Bruker Corporation announced the release of the Dektak XTL Stylus Profiler, extending its industry-leading stylus profilometry capabilities to 200 and 300 millimeter semiconductor wafer fabs and next-generation touch panel manufacturers. The system provides the most cost-effective, full 300-millimeter wafer solution for characterizing thin film step heights, resist step heights, line edge roughness, CMP dishing and erosion, as well as roll off amount (ROA). The Dektak XTL combines decades of stylus innovation with new features targeting QA/QC environments to enable increased accuracy and minimal operator intervention between loading and unloading samples.