The Company's Board of Directors resolved to
convene the 2022 Annual General Shareholders' Meeting
Date of events
2022/03/07
To which item it meets
paragraph 17
Statement
1.Date of the board of directors resolution:2022/03/07
2.General shareholders' meeting date:2022/06/08
3.General shareholders' meeting location:No. 176-5, 6 Ling,
Hualung Chung Chun, Chiung Lin, 307 Hsi-Chiu Hsien, Taiwan
4.Cause for convening the meeting I.Reported matters:
(1)2021 business report
(2)Audit Committee's review of the 2021 annual final accounting
ledgers and statements
(3)Report on 2021 employees' and directors' remuneration
(4)Report on cash dividends distribution of the 2021 earnings
5.Cause for convening the meeting II.Acknowledged matters:
(1)Acknowledgment of the 2021 business report and annual final
accounting ledgers and statements
(2)Acknowledgment of the 2021 Earnings Distribution
6.Cause for convening the meeting III.Matters for Discussion:
Discussion of the Amendments to the Articles of Incorporation
7.Cause for convening the meeting IV.Election matters:None
8.Cause for convening the meeting V.Other Proposals:None
9.Cause for convening the meeting VI.Extemporary Motions:None
10.Book closure starting date:2022/04/10
11.Book closure ending date:2022/06/08
12.Whether to announce proposal for profit distribution
or loss off-setting in "Status of dividend distribution
" section of MOPS:yes
13.Please explain the reason for not announcing proposal
for profit distribution or loss off-setting:NA
14.Any other matters that need to be specified:None
Attachments
Original Link
Original Document
Permalink
Disclaimer
Winstek Semiconductor Co Ltd. published this content on 07 March 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 07 March 2022 06:38:07 UTC.
Winstek Semiconductor Co Ltd, formerly STATS ChipPAC Taiwan Semiconductor Corp., is principally engaged in the provision of semiconductor testing services. The Company provides wafer testing services and IC testing services, including wafer sort and final test services. It also involves in information software services and manufacture of electronic components. The Companyâs services are used for testing of consumer/personal computer (PC) products, embedded flash products, graphics, wafers and other electronic products. The Company operates its businesses within domestic market and in overseas markets.