VIA Technologies : VAB-630 Platform Accelerates Smart Signage Innovation
January 24, 2017 at 05:10 am EST
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Taipei, Taiwan, January 24, 2017 - VIA Technologies, Inc, today unveiled the new VIA VAB-630 HMI system platform for accelerating the deployment of smart signage installations in retail, office, and factory environments.
Combining a highly-integrated 3.5' SBC form factor motherboard with an optional 10.1' touch panel screen, the VIA VAB-630 comes with a raft of advanced compute, graphics and video features to ensure optimum performance for interactive multimedia applications in kiosks, signage displays, and factory automation HMI systems. Functionality can be further enhanced with the integration of optional wireless communication modules, including a combination USB Wi-Fi and Bluetooth module or miniPCIe 3G module.
'The VIA VAB-630 provides a compact yet highly-scalable platform for building smart signage and HMI systems,' commented Richard Brown, VP of International Marketing, VIA Technologies, Inc. 'With its highly-flexible design, the platform can be customized to meet the exact usage requirements - whether it's a smart retail signage system or multimedia information kiosk.'
Join VIA in booth #2-551 of Hall 2 at the upcoming Embedded World 2017 exhibition being held this March 14-16 in Nuremberg, Germany to see the latest VIA Smart Signage and HMI solutions, including the VIA VAB-630 platform.
VIA VAB-630
The VIA VAB-630 delivers advanced multimedia performance, rich I/O and wireless connectivity support, and advanced software development tools for a host of gateway, signage and HMI applications. Key features include:
Compact 3.5' SBC form factor measuring just 14.6cm x 10.2cm
0GHz dual core VIA Cortex-A9 SoC
Support for smooth 1080p video playback
Rich I/O support, including HDMI, Mini-PCIe, USB 2.0, UART, SIM Card slot, and DIO
Support for 3G, Wi-Fi, & BT wireless connectivity
Optional 5V or 12V power input
Android 5.0 BSP with VIA Smart ETK comprising a number of APIs, including Watchdog Timer (WDT), GPIO and UART access, and a sample app.
Optional 10.1″ LVDS LCD touch panel available
A full set of hardware and software customization services that speed up time to market and minimize development costs are also available.
For more information about the VIA VAB-630, please visit: https://www.viatech.com/en/boards/3-5-inch-sbc/vab-630/
For images related to this release, please visit: http://www.viagallery.com/vab-630/
For more information about VIA at Embedded World 2017, please visit: https://www.viatech.com/en/embedded-world-2017
About VIA Technologies, Inc.
VIA Technologies, Inc is a global leader in the development of highly-integrated embedded platform and system solutions for M2M, IoT, and Smart City applications, ranging from video walls and digital signage to healthcare and industrial automation. Headquartered in Taipei, Taiwan, VIA's global network links the high tech centers of the US, Europe and Asia, and its customer base includes the many world's leading hi-tech, telecommunications, consumer electronics industry brand names. www.viatech.com
VIA Technologies Inc. published this content on 24 January 2017 and is solely responsible for the information contained herein. Distributed by Public, unedited and unaltered, on 24 January 2017 10:10:05 UTC.
Original documenthttp://www.viatech.com/en/2017/01/smart-signage-vab-630-platform/
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VIA Technologies, Inc. is a Taiwan-based company principally engaged in the design, research, development, manufacture and distribution of chips. The Companyâs products include central processing unit, logic chip, embedded control platform solution, Low-power multi-function system chip, x86 processor, multimedia control chip, digital electronic board player, industrial control fan-free system, Tablet PC, embedded module and peripheral accessories. The Company distributes its products within domestic market and to overseas markets.