Ventec International : Announcement on behalf of Ventec Electronics (HK) Company Limited under the Article 22-1-1 of Regulations Governing Loaning of Funds
Announcement on behalf of Ventec Electronics
(HK) Company Limited under the Article 22-1-1 of
Regulations Governing Loaning of Funds
Date of events
2022/06/30
To which item it meets
paragraph 23
Statement
1.Date of occurrence of the event:2022/06/30
2.The public company or its subsidiaries for which the amount of monetary
loans extended to others reaches 20 percent or more of the public company's
net worth on the latest financial statements, please specify name of funding
recipient, relationship with lender, lending limit (thousand NTD),
outstanding balance (thousand NTD) up to the date of occurrence and
the reason for lending up to the date of occurrence:
(1)Funding recipient: Ventec Central Europe GmbH.
(2)Relationship with lender:
For the Company (Ventec International Group Co., Ltd.) directly or
indirectly owned 100% of foreign subsidiaries.
(3)Lending limit (thousand NTD): NT$ 3,327,660 Thousand
(4)Outstanding balance (thousand NTD) up to the date of occurrence:
NT$ 116,180 Thousand
(5)The reason for lending up to the date of occurrence: Working capital
3.The total amount of monetary loans extended to others as of the date of
occurrence:NT$798,738 Thousand.
4.The total amount of monetary loans extended to others as a percentage of
the public company's net worth on the latest financial statements as of the
date of occurrence:28.46%
5.Sources of funds for the company to extend monetary loans to others:
subsidiary itself
6.Any other matters that need to be specified: None
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Ventec International Group Co. Ltd. published this content on 30 June 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 30 June 2022 06:21:04 UTC.
Ventec International Group Co Ltd is a company mainly engaged in the research and development, production and sales of copper foil substrates, aluminum substrates and special material substrates. The Company's main products include copper foil substrates for double-sided printed circuit boards, inner copper foil substrates and adhesive sheets for multi-layer printed circuit boards, and aluminum substrates. The products are mainly suitable for mobile phones, communications, automotive electronics and other fields. The Company mainly conducts business in the Asian, European and American markets.
Ventec International : Announcement on behalf of Ventec Electronics (HK) Company Limited under the Article 22-1-1 of Regulations Governing Loaning of Funds