Veeco Instruments Inc. has received multiple orders from a foundry in Asia for its Precision Surface Processing, or PSP, WaferStorm system. The WaferStorm platform provides wafer processing solutions for advanced packaging applications. Veeco's flux cleaning technology will process wafers for Fan-out Wafer Level Packaging (FO-WLP) production.

Fluxing is critical to both wafer bumping and joint formation processes because it removes oxide layers and other impurities to ensure a clean metallic interface for the next assembly step. As bump pitches become finer, removing flux residues has become more challenging. Veeco's proprietary technology is well suited for removal of flux residues from even the tightest spacing.

The WaferStorm platform offers flexible solutions for thick film removal, flux clean and through-silicon via (TSV) clean. The WaferEtch system enables selective etching required for TSV reveal, under-bump metallization and redistribution layer processes. Veeco's global footprint and customer connectivity, notably in Asia, are helping to capitalize on PSP's growing technology and business.