Tokyo Seimitsu Co., Ltd. Provides Year End Dividend Guidance for the Year Ending March 31, 2023
February 06, 2023 at 01:00 am EST
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Tokyo Seimitsu Co., Ltd. provided year end dividend guidance for the year ending March 31, 2023. The company expects to pay year end dividend of JPY 109.00 per share compared to JPY 101.00 per share paid a year ago.
Tokyo Seimitsu Co Ltd is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing equipment and precision measuring equipment. The Semiconductor Manufacturing Equipment segment is engaged in the manufacture and sale of processing and inspection equipment for the manufacture of semiconductor, such as wafer probing machines and wafer dicing machines, as well as the provision of after-sales services and the development of related software. The Measuring Equipment segment is engaged in the manufacture and sale of precision measuring equipment for three-dimensional (3D) vision systems, as well as surface roundness and profile shape measuring instruments including 3D coordinate measuring machine, true degree and column shape measuring machine, surface roughness measuring machine, wheel shape measuring machine and others.