TE Connectivity announced the launch of its new Sliver internal cabled interconnects, which provide one of the most flexible solutions in the market for making internal input/output (I/O) connections on the board. This new technology simplifies design and helps lower overall costs by eliminating the need for re-timers and costlier, lower-loss printed circuit board (PCB) materials, while reaching speeds up to 25 gigabits per second (Gbps) with the use of TE high speed cable. As rates increase for data communications equipment like servers, switching, routers, and storage, the standard PCB material has too much uncontrolled signal loss to allow for clean transmission of these signals through PCB traces. TE's Sliver interconnect product line provides an inexpensive, robust solution with a small, high-density connector and cable assembly that routes high-speed signals from the microprocessors to other locations (e.g. to other boards, to other microprocessor chips, to the backplane, to I/O).