Tangshan Sanfu Electronic Materials Co., Ltd announced a private placement of common shares for the gross proceeds of CNY 120,000,000 on March 30, 2023. The transaction will include participation from returning investor Tangshan Sunfar Silicon Industries Co.,Ltd. The transaction has been approved in the 26th Meeting of the Company's 4th Directorate and does not need the shareholders approval. The registered capital of the company will increase from CNY 180,000,000 to CNY 300,000,000.
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5-day change | 1st Jan Change | ||
11.72 CNY | -0.26% | -4.33% | -34.82% |
Annual profits - Rate of surprise
1st Jan change | Capi. | |
---|---|---|
-34.82% | 618M | |
+18.91% | 67.29B | |
-6.54% | 45.32B | |
+23.68% | 43.72B | |
+37.55% | 28.07B | |
+9.03% | 19.24B | |
+15.11% | 17.22B | |
-26.04% | 14.64B | |
-13.27% | 14.51B | |
-29.84% | 11.58B |
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- News Tangshan Sunfar Silicon Industries Co.,Ltd.
- Tangshan Sanfu Electronic Materials Co., Ltd announced that it expects to receive CNY 120 million in funding from Tangshan Sunfar Silicon Industries Co.,Ltd.