Soitec extends partnership with UMC
UMC's 3D IC solution for RF-SOI technology addresses the challenge of integrating more radio frequency (RF) front-end modules - essential smartphone components that transmit and receive data - into a single device by vertically stacking chips and using plate-to-plate bonding technology.
It reduces chip size by more than 45%, enabling customers to integrate more RF components to meet 5G bandwidth requirements.
Soitec's RF-SOI substrates play a key role in providing the mechanical and electrical performance needed to ensure high-volume manufacturing of UMC's solution without degrading RF performance.
' The combined experience and expertise of UMC and Soitec puts us in an ideal position to drive innovation and meet the future challenges of low-power RF front-end modules while optimizing their volume. By extending the field of RF-SOI solutions to 3D integration, future smartphones will adapt to the new frequency bands envisaged for the 5G-Advance and 6G era, while making room for the new functionalities to come', said Jean-Marc Le Meil, Executive Vice President of Soitec's Mobile Communications Division.
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