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Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the Half Year Ended June 30, 2022 CI
Danbond Technology Booted From Shenzhen Bourse MT
Shenzhen Danbond Technology Co.,Ltd. Announces Board Changes CI
Shenzhen Danbond Technology Co.,Ltd.(SZSE:002618) dropped from Shenzhen Stock Exchange A Share Index CI
Shenzhen Danbond Technology Co.,Ltd.(SZSE:002618) dropped from Shenzhen Stock Exchange Composite Index CI
Danbond Technology’s Shares to Enter Delisting Transitional Period MT
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2022 CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the Nine Months Ended September 30, 2021 CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the Half Year Ended June 30, 2021 CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2021 CI
Shenzhen Danbond Technology Co.,Ltd.(XSEC:002618) dropped from S&P Global BMI Index CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the Nine Months Ended September 30, 2020 CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the Half Year Ended June 30, 2020 CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2020 CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the Full Year Ended December 31, 2019 CI
Shenzhen Danbond Technology Co.,Ltd. announced that it expects to receive CNY 1.78 billion in funding CI
Shenzhen Danbond Technology Co.,Ltd. cancelled the transaction announced on June 13, 2019 CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the Nine Months Ended September 30, 2019 CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the Half Year Ended June 30, 2019 CI
Shenzhen Danbond Technology Co.,Ltd.(SZSE:002618) added to Shenzhen Stock Exchange Component Index CI
Shenzhen Danbond Technology Co.,Ltd. announced that it expects to receive CNY 2.15 billion in funding CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2019 CI
Shenzhen Danbond Technology Co.,Ltd. Reports Earnings Results for the Full Year Ended December 31, 2018 CI
Shenzhen Danbond Technology Co.,Ltd. Announces Distribution; Announces Executive Changes CI
Certain shares of Shenzhen Danbond Technology Co., Ltd.'s A Shares are subject to a Lock-Up Agreement Ending on 20-SEP-2014. CI
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Shenzhen Danbond Technology Co., Ltd. is a China-based company, principally engaged in the research and development, manufacture and distribution of electronic components. The Company's products mainly include flexible printed circuit boards (FPCs), chip on film (COF) flexible packaging substrates, as well as COF products. The Company's products are mainly applied in electronic terminals. The Company distributes its products within domestic market and to overseas markets, with Japan as its major market.
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