SEALSQ Corp. announced that it extends its available "on-wafer" semiconductor provisioning offering with a new 4-week lead-time "on-Package" chip personalization service. Through this new service, SEALSQ is now able to offer its clients the option to personalize off-the-shelf secure elements from its VaultIC??

range with certificates and keys and deliver the pre-loaded chips in less than 4 weeks packed in reels from 1,000 to 20,000 units. SEALSQ's ability to quickly adapt it offerings by launching new products with fast time-to-market lead time, aims to address IoT device maker's demands who are looking to run small-batch manufacturing before scaling up production. The core of SEALSQ's value proposition is to be a vertically integrated security offering.

It means in practice that its secure element range can be pre-provisioned with private keys and certificates compliant with protocols such as MATTER, Wi-SUN or OPC for seamless authentication as well as commissioning with Microsoft AZURE or AWS Clouds. Chip Personalization is traditionally performed in the semiconductor industry at an early stage of the production process, requiring large order volumes and several months lead-time before delivery. A growing number of IoT industry standards like Matter, national cybersecurity labels like the US Cyber Trust Mark, and EU regulations like the Cyber Resilience Act are shaping the IoT security landscape.

They all require that IoT devices securely embed a unique trusted identity in the shape of certificates and private keys, as a cornerstone to the IoT security framework.