Samsung Electro Mechanics : launches new small size Metal Power Inductor for vehicles
March 20, 2024 at 04:32 am EDT
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Tech - Article2024.03.20
Samsung Electro-Mechanics launches new small size Metal Power Inductor for vehicles
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▷ The 38 models of small Power Inductors for vehicles under 1210 inch (3.2×2.5mm) in size have been launched. Samples are now available.
▷ As the application of ECUs and the number of onboard of DC-DC converters increases due to the electrification and high functionality of automobiles, small size Power Inductors with excellent electrical characteristics are required within limited spaces.
▷ Samsung Electro-Mechanics applied an optimized thin-film type coil structure and proprietary magnetic materials to achieve lower DC resistance, higher rated current, and higher efficiency characteristics compared to market products.
▷ Through differentiated powder insulation coating and external electrodes with enhanced bonding force, it meets a wide range of operating temperature (-55℃~150℃), 40V rated voltage and AEC-Q200 reliability.
▷ It is applicable to various automotive applications including ADAS (Advanced Driver Assistance System) and IVI (In-Vehicle Infotainment).
Lineup for small metal Power Inductor
* 0805 inch 1.0T (0.24~2.2uH) / 0806 inch 1.0T (0.1~2.2uH) / 1008 inch 1.2T (0.1~4.7uH) / 1210 inch 1.2T (0.15~10uH)
Characteristic data ( ex : 0806 inch Metal Power Inductor )
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#Product details
#Product Inquiry
#Previous Article
#Vehicle Product Lineup
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Samsung Electro-Mechanics Co. Ltd. published this content on
20 March 2024 and is solely responsible for the information contained therein. Distributed by
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20 March 2024 08:31:02 UTC.
Samsung Electro-Mechanics Co Ltd is a Korea-based company mainly engaged in the manufacture and distribution of electronic components. The Company operates its business through three segments. The Component Solution segment is involved in the production and sale of passive elements such as multi layers ceramic capacitors (MLCC), inductors, chip resistors. The Module Solution segment is involved in the production and sale of module products, including camera modules and communication modules. The Board Solution segment is involved in the production and sale of semiconductor package substrates and high-density multilayer boards. The Company distributes its products in domestic and overseas markets such as America, Europe and Southeast Asian countries, China and Japan.