TYAN's Servers and Motherboards Add Support For New Intel Xeon Processor E5-2600 v4 Product Family
Taipei, Taiwan - Apr 26, 2016-TYAN, an industry-leading server platform design manufacturer and subsidiary of MITAC Computing Technology Corporation, announces support for the new Intel Xeon processor E5-2600 v4 product family. Incorporating Intel's new processor technologies allows TYAN to offer the latest performance and power savings features available. TYAN's Xeon E5 platform-based server systems and motherboards continue to offer the high performance, power efficiency, and required reliability on the market.
'The latest Intel Xeon processor E5-2600 v4 product family is built upon an advanced 14nm process technology and increases the core and thread count per socket. These new processors allow us to offer the latest in memory speed and capacity, energy efficiency, and performance. This lets our customers run their applications in the best possible environment,' said Albert Mu, Vice President of MITAC Computing Technology Corporation's TYAN Business Unit. 'TYAN's Dual-Socket Intel Xeon processor E5-2600 v4-based platforms are now capable of offering up to 44 cores and 88 threads per motherboard along with 1.5TB of DDR4-2400 memory speed, which enables enterprise and datacenter customers to benefit from the latest advances in cloud computing, HPC, and storage applications.'
'The new Intel Xeon processor E5-2600 v4 product family delivers the outstanding performance, power efficiency, increased orchestration capabilities and enhanced security to span the diverse needs of next-generation datacenters,' said Lisa Spelman, Vice President, Intel Data Center Group, and General Manager, Intel Xeon Products. 'Our collaboration with TYAN helps drive innovation on Intel's leading-edge technologies to address the needs of the broad range of workloads delivered via the next generation of cloud computing.'
HPC Servers:
-FT77C-B7079 : 4U dual-socket Intel Xeon processor E5-2600 v4-based platform with support for up to 8 Intel Xeon Phi™ coprocessor modules
-TA80-B7071: 2U dual-socket Intel Xeon processor E5-2600 v4-based platform with support for up to 4 Intel Xeon Phi coprocessor modules
-GA80-B7081: 1U dual-socket Intel Xeon processor E5-2600 v4-based platform with support for up to 3 Intel Xeon Phi coprocessor modules
-FT48A-B7070: 4U dual-socket platform supports up to 8x LFF and 8x SFF drives
-GF83-B7074 : 1U front-serviced dual-socket platform supports up to 8x LFF, 18x SFF, or 8x NVMe drives
-GT62B-B707 6: 1U dual-socket platform supports up to 6x SFF and 4x NVMe drives
-GT86A-B70 831U dual-socket platform supports up to 12x LFF and 1x SFF drives
-GT24B-B7 076: 1U dual-socket platform supports up to 4x LFF drives
-GN70-B 7086: 1U dual-socket platform supports up to 8x LFF drives
-GT56- B7086: 1U dual-socket platform supports up to 10x SFF drives
-S7070: Dual-socket board with 16x DDR4 DIMM slots in EEB (12' x 13') form factor for 2U or pedestal server/workstation deployment
-S7076: Dual-socket board with 16x DDR4 DIMM slots with I/O mezzanine options in rack-optimized, EATX (12' x 13') form factor for 1U intermediate server deployment
-S7077: Dual-socket board with 8x DDR4 DIMM slots with I/O mezzanine options in CEB (12' x 10.5') form factor for compact server deployment
-S7082: Dual-socket board with 24x DDR4 DIMM slots with I/O mezzanine options in EEB (12' x 13') form factor for 2U or pedestal VM server deployment
-S7086: Dual-socket board with 16x DDR4 DIMM slots with I/O mezzanine options in rack-optimized, EATX (12' x 13') form factor for 2U full-featured server deployment
-S5620: Single-socket board with 8x DDR4 DIMM slots with I/O mezzanine options in ATX (12' x 9.6') form factor for entry server deployment
Intel, Xeon and Xeon Phi are trademarks or registered trademarks of Intel Corporation in the United States and other countries.
About TYAN
For more information, visit MiTAC Holdings Corporation's website at http://www.mic-holdings.com or TYAN's website at http://www.tyan.com
MiTAC International Corporation issued this content on 26 April 2016 and is solely responsible for the information contained herein. Distributed by Public, unedited and unaltered, on 29 April 2016 06:36:30 UTC
Original Document: http://www.mitac.com/news/News_346.aspx