Micron Technology, Inc. and Valens Demonstrate Industry’s First In-Vehicle Remote, Centralized Storage Solution
January 07, 2020 at 04:01 pm EST
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Micron Technology, Inc. and Valens demonstrating the automotive industry’s first 1TB remote, centralized storage solution at the Consumer Electronics Show in Las Vegas. Based on Micron’s recently announced automotive-compliant ball grid array (BGA) solid-state drive and Valens’ advanced automotive connectivity technology, the combined solution is capable of tunneling PCIe over long distances on a single cable supporting up to 16Gbps of data transfer over low-cost, unshielded wiring. Through this collaboration, Micron and Valens are enabling next-generation automotive platforms that will help fulfill the promise of autonomous, advanced driver-assistance systems (ADAS) as well as tomorrow’s in-vehicle infotainment (IVI). The MIPI® Alliance, a collaborative global standardization organization serving industries that develop mobile and mobile-influenced devices, recently selected Valens’ technology as the baseline for its long-reach, high-speed connectivity A-PHY automotive application standard. Valens’ automotive technology provides resilient, ultra-high-speed in-vehicle connectivity to meet the needs of today’s and tomorrow’s connected cars. Micron was the first to introduce 1TB automotive- and industrial-grade PCIe NVMe™ SSDs, which are designed for next-generation autonomous cars and the industrial internet of things (IIoT). Taken together, these solutions address growing data and connectivity requirements in next-generation autonomous vehicles, delivering faster, more reliable and cost-effective storage. Micron and Valens’ new storage solution allows architects and designers to locate storage anywhere within the vehicle for optimal use and fit, which will ultimately enrich the driving experience. Micron and Valens will demonstrate this technology at CES 2020 (LVCC, North Hall, Booth 9005).
Micron Technology, Inc. specializes in the design, manufacturing and marketing of semiconductors. The group's products include memory products (dynamic memories, flash memories, etc.) and semiconductor systems. Net sales break down by market as follows:
- IT infrastructure (36.7%): computers, network systems, graphics systems and cloud servers;
- phones and mobile devices (23.4%): smartphones, tablets and mobile devices;
- storage media (16.4%): mainly fixed and removable data storage components;
- other (23.5%): primarily automotive, connected home and consumer electronics and industries markets.
As of 31/08/2023, the group has 11 manufacturing sites worldwide.
Net sales are distributed geographically as follows: the United States (50.2%), Taiwan (17.4%), China (14%), Japan (6.4%), Hong Kong (2.1%), Asia/Pacific (4.8%), Europe (4.4%) and other (0.7%).
MICRON TECHNOLOGY, INC. 
