Micron Technology, Inc. has partnered with Qualcomm Technologies, Inc. to develop advanced solutions for next-generation in-vehicle cockpit compute systems. The increased level of technology needed to enhance in-cabin experiences requires system-level design expertise and innovation to efficiently accelerate technology integration. To aid in these efforts, Micron is helping Qualcomm Technologies optimize Micron’s new high-density automotive-grade LPDDR4X memory devices for third-generation Qualcomm Snapdragon Automotive Cockpit Platforms. Together, the companies are also working to validate and integrate Micron’s memory solutions into Snapdragon Automotive Cockpit Platforms to provide high-performance reference solutions for Qualcomm’s customers. Micron’s LPDDR4X memory devices provide a system capacity range between 2 GB and 16 GB with throughput rates of up to 546 Gb/s. This fast throughput supports high-resolution 3D graphic displays in automotive infotainment systems along with the requisite memory bandwidth associated with compute-intensive platforms ideal for advanced driver-assistance systems (ADAS). The Snapdragon Automotive Cockpit Platforms are designed to deliver higher levels of computing needed for advanced capabilities featured in future-generation vehicles, including highly intuitive artificial intelligence (AI) experiences. The platforms’ design also enables precise navigation capabilities and provides immersive audio and rich visual experiences.