Macronix International Co., Ltd. announced that the NAND MCP memory solution has been adopted and incorporated by Qualcomm Technologies Inc. as a part of the reference design for a Qualcomm Technologies' LTE Cat. M1/NB-1 chipset, the MDM9206 modem. Macronix's industry-standard multichip packages (MCPs) combine RAM and Flash memories into one package, satisfying the demands of today's consumers on their mobile and connected devices. The NAND MCP is co-developed with its strategic RAM partner, AP Memory. With minimal footprint, excellent performance and the high quality and power efficiency, the Macronix NAND MCPs offer an ideal integrated memory solution for this rapidly growing market. In addition, the Macronix Product Longevity Program brings reliable and sustainable memory support.