Macronix International Co., Ltd. Incorporates in New Qualcomm Technologies' LTE IoT Chipset Reference Design
January 12, 2017 at 11:10 am EST
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Macronix International Co., Ltd. announced that the NAND MCP memory solution has been adopted and incorporated by Qualcomm Technologies Inc. as a part of the reference design for a Qualcomm Technologies' LTE Cat. M1/NB-1 chipset, the MDM9206 modem. Macronix's industry-standard multichip packages (MCPs) combine RAM and Flash memories into one package, satisfying the demands of today's consumers on their mobile and connected devices. The NAND MCP is co-developed with its strategic RAM partner, AP Memory. With minimal footprint, excellent performance and the high quality and power efficiency, the Macronix NAND MCPs offer an ideal integrated memory solution for this rapidly growing market. In addition, the Macronix Product Longevity Program brings reliable and sustainable memory support.
MACRONIX INTERNATIONAL CO., LTD. is a Taiwan-based company principally engaged in the design, manufacture and distribution of integrated circuits (ICs) and memory chips. The Company mainly provides non-volatile memory ICs, including mask read only memory (ROM) products and Xtra ROM products, as well as NOR flash products and NAND flash products. The Company is also engaged in the provision of wafer foundry services, including sub-micron logic processing, high-pressure complementary metal oxide semiconductor (CMOS) processing, embedded ROM processing and other services. The Company distributes its products within the domestic market and to overseas markets, including Japan, America, Europe and the rest of Asia.