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Lite-On Semiconductor Corp.

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5305

TW0005305007

Lite-On Semiconductor Corp Announces Changes to the Remuneration Committee

June 13, 2016 at 06:38 am EDT

Lite-On Semiconductor Corp. announced that Golden Wang, Independent Director of LSC; Jimmy Wang, Independent Director of LSC; and Hsung Hsiung Tsai,Remuneration Committee of LSC were replaced with Chin Su Sun, Chairman of Lixin Management Consulting Ltd.; Jimmy Wang, Independent Director of LSC; and Paul Lo, Ex-CEO of STI as Independent Directors for the 3rd Term of Remuneration Committee. Effective date of the new members is June 13, 2016.

Latest news about Lite-On Semiconductor Corp.

Lite-On Semiconductor Corp.(UNQ:5305) dropped from Taiwan TAIEX Index	20-12-08	CI
Diodes Incorporated completed the acquisition of Lite-On Semiconductor Corp. from Lite-On Capital Corporation and Lite-On Technology Corporation.	20-11-29	CI
Lite-On Semiconductor Corp. Reports Earnings Results for the Third Quarter Ended September 30, 2020	20-11-12	CI
Lite-On Semiconductor Corp.(TSEC:5305) dropped from S&P Global BMI Index	20-10-20	CI
Lite-On Semiconductor Corp. Announces Address Change	20-10-19	CI
Lite-On Semiconductor Corp. Reports Earnings Results for the Second Quarter Ended June 30, 2020	20-08-12	CI
Lite-On Semiconductor Corp. Declares Cash Dividend for the Year 2019	20-06-19	CI
Lite-On Semiconductor Corp. Reports Earnings Results for the First Quarter Ended March 31, 2020	20-05-13	CI
Lite-On Semiconductor Corp. Reports Earnings Results for the Full Year Ended December 31, 2019	20-03-30	CI
A consortium comprising Pavilion Capital Pte. Ltd., Axiom Asia Private Capital and others entered into a merger agreement to acquire 83.5% stake in On-Bright Electronics Incorporated from Lite-On Semiconductor Corp. and others for TWD 10.8 billion.	20-01-07	CI
Lite-On Semiconductor Corp. Reports Earnings Results for the Third Quarter Ended September 30, 2019	19-11-12	CI
Lite-On Technology Corporation completed the acquisition of remaining 50.51% stake in Lite-On Japan Ltd.(JASDAQ:2703) from Silitech Technology Corporation, Lite-On Semiconductor Corp. and other sellers.	19-08-30	CI
Lite-On Semiconductor Corp. Reports Earnings Results for the Second Quarter Ended June 30, 2019	19-08-12	CI
Diodes Incorporated entered into an agreement to acquire Lite-On Semiconductor Corp. for approximately TWD 2.7 billion.	19-08-07	CI
Lite-On Semiconductor Corp. Announces Cash Dividends for 2018	19-06-26	CI
Lite-On Semiconductor Corp. Declares Distribution for the Year 2018	19-06-18	CI
Lite-On Technology Corporation made an offer to acquire remaining 50.51% stake in Lite-On Japan Ltd.(JASDAQ:2703) from Silitech Technology Corporation, Lite-On Semiconductor Corp. and other sellers for ¥1.5 billion.	19-06-02	CI
Lite-On Semiconductor Corp. Reports Earnings Results for the First Quarter Ended March 31, 2019	19-05-13	CI
Lite-On Semiconductor Corp Reports Earnings Results for the Full Year Ended December 31, 2018	19-03-27	CI
Lite-On Semiconductor Corp Appoints Karin Huang as Corporate Governance Officer	19-03-20	CI
Lite-On Semiconductor Signs Franchise Distribution Agreement with New Yorker Electronics to Supply its Discrete Power Management Devices Around the World	19-01-30	CI
Lite-On Semiconductor Corp. Announces the Resignation of Albert Chang, Director of LSC	19-01-29	CI
Lite-On Semiconductor Corp. Reports Consolidated Earnings Results for the Third Quarter and Nine Months of 2018	18-11-09	CI
Lite-On Semiconductor Corp. Reports Consolidated Earnings Results for the Second Quarter and Six Months of 2018	18-08-10	CI
Lite-On Semiconductor Corp. Announces Adjustment of Dividend Payout Ratio from 2017 Earnings	18-07-04	CI

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Company Profile

Lite-on Semiconductor Corp. is a Taiwan-based company principally engaged in the design, manufacture and sale of semiconductor components. The Company mainly provides contact image sensor (CIS), integrated solution ICs, semiconductor components and wafer foundry services. The Company's integrated solution ICs includes integrated ambient lights, proximity sensor modules, infrared light emitting diode (LED) and others. The Company's semiconductor components include discrete, analog ICs, sensor ICs and others. The Company's products and services are mainly applied in the power supply of computer, communication and consumer electronic (3C), industrial, lighting, automobile and other industries. The Company distributes its products primarily in Asia, Europe and the Americas.

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