Hua Hong Semiconductor Limited proposed final dividend for the year ended 31 December 2023 of HKD 0.165 per share. Date of shareholders' approval: 9 May 2024. Ex-dividend date: 3 June 2024.
Record date: 6 June 2024. Payment date: 26 June 2024.
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Hua Hong Semiconductor Limited proposed final dividend for the year ended 31 December 2023 of HKD 0.165 per share. Date of shareholders' approval: 9 May 2024. Ex-dividend date: 3 June 2024.
Record date: 6 June 2024. Payment date: 26 June 2024.
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