Cypress Semiconductor Corp. began showcasing three new Bluetooth Low Energy modules and a new demonstration of a Bluetooth Smart Mesh solution at the International Consumer Electronics Show in the South Hall of the Las Vegas Convention Center. The three modules bring the unmatched ease-of-use, integration and programmability of Cypress's EZ-BLE PRoC family to a broader range of applications, including the Internet of Things (IoT), health and fitness equipment, home appliances and toys.

The Bluetooth Smart Mesh demonstration shows an implementation for lighting applications that is compliant with the latest proposal from the Bluetooth Smart Mesh Working Group. Mesh networking extends the range of Bluetooth by allowing devices to send data to and receive data from multiple neighboring devices—a critical capability for many IoT applications. Cypress is also showcasing its recently introduced Bluetooth 4.2 chips, which are the single-mode solutions to be certified for all three key features of the Bluetooth 4.2 standard: data length extension, privacy and enhanced security.

The EZ-BLE PRoC modules integrate the programmability and ARM® Cortex®-M0 core of Cypress's PRoC BLE Programmable Radio-on-Chip, two crystals, an on-board antenna, metal shield and passive components. The three new EZ-BLE PRoC modules are: The CYBLE-222005-00 module that integrates Cypress's CapSense® capacitive touch-sensing technology and 256KB of Flash memory with 32KB SRAM all in a very small 10-mm x 10-mm x 1.8-mm form factor. The module is fully qualified by the Bluetooth Special Interest Group (SIG) and is fully compliant to wireless regulatory standards in the U.S., Canada, Japan, Korea and Europe, greatly reducing development, testing and certification costs for customers.

The module is a footprint-compatible memory upgrade to the original EZ-BLE PRoC module with 128KB of Flash. The CYBLE-012011-00 module that integrates CapSense and 128KB Flash memory with 16KB SRAM in a 14.5-mm x 19.2-mm x 2.0-mm form factor. This module is also fully certified and is optimized to reduce bill-of-material (BOM) costs and for applications that do not require a smaller footprint.

The CYBLE-012012-10 module that integrates 128KB Flash memory with 16KB SRAM and is shipped without an RF metal shield to minimize its height, offering a 14.5-mm x 19.2-mm x 1.55-mm form factor. The CYBLE-222005-00, CYBLE-012011-00 and CYBLE-012012-10 EZ-BLE PRoC modules are each currently sampling and will be in production in February 2016.