Aehr Test Systems announced its new FOX-NP Test and Burn-in System for wafers, panels, singulated die and modules. The FOX-NP system is a new configuration within the Company’s FOX-PTM product family that is a low cost, small footprint entry-level system providing a configuration and price point for companies to do initial product development, product qualification and production. The FOX-NP System will begin volume shipments early in Aehr Test’s fiscal fourth quarter ending May 31, 2019. Aehr Test will showcase the new FOX-NP system in Booth 4046 at the SPIE Photonics West conference at the Moscone Convention Center in San Francisco February 2-7, 2019. The FOX-NP system is 100% compatible with the FOX-XPTM Test and Burn-in System. It uses the same blades as the FOX-XP system and is configurable with up to two blades, versus the FOX-XP high-volume production system that can be configured with up to 18 blades. Aehr Test’s FOX-P platform is the company’s next-generation multi-wafer and singulated die/module test solution that is capable of functional test and burn-in/cycling of photonics devices, flash memories, microcontrollers, sensors, and other ICs before they are assembled into single or multi-die stacked packages. The FOX-P wafer-level systems utilize Aehr Test's FOX WaferPakTM contactors, which provide cost effective solutions for making electrical contact with a full wafer or substrate in a multi-wafer environment. The configuration with the DiePak® Carriers enables burn-in of singulated die and multi-die modules to screen for defects in both the die and the module assembly process. The resulting known-good die, single-die or stacked-die packaged parts can then be used for high reliability and quality applications such as enterprise solid state drives, automotive devices, highly valuable mobile applications, and mission critical integrated circuits and sensors. The key features of the FOX-P platform that contribute to the cost-effectiveness of the solution include the ability to provide up to 2,048 “Universal Channels” per wafer or DiePak carrier, which allows the system to test all the devices on the wafer or DiePak carrier in parallel. The innovative “Universal Channel” architecture allows any channel to be any function (I/O, Device Power Supply (DPS) or Per-pin Precision Measurement Unit (PPMU)). This enhanced architecture now allows customers to perform per pin parametric testing, more extensive digital pattern test with deeper data stimulus /capture memory (32M per pin), and deeper scan (768M) optimized for BIST/DFT testing. A single FOX-XP test system may be configured with up to 18 blades of wafer test resources, enabling up to 18 wafers to be tested simultaneously. The footprint of the 18-wafer FOX-XP test system is similar to the footprint of typical semiconductor Automatic Test Equipment (ATE) that can only test one wafer at a time. The highly integrated 2-blade FOX-NP system has a very small footprint and is designed to be easily integrated into product design, reliability and test lab applications.