3M Company announced at DesignCon 2013 the full launch of its Embedded Capacitance Material (ECM) C2006. The ultra-thin laminate material is now available for high-volume manufacturing. With a capacitance density of approximately 20 nF per square inch, the material offers one of the high capacitance densities currently available on the market in a halogen-free product.

ECM C2006 boosts design engineers' ability to improve power integrity and reduce electromagnetic interference (EMI) in small devices -- such as microphones, sensors, IC packaging and interposers -- where space limitations require the high capacitance density feasible to achieve the desired performance. The material's high capacitance density helps designers achieve hi-fidelity signals, high signal-to-noise ratio in radio frequencies and higher speed digital signals in a variety of high-performance applications.