Ping Hsien Wu
Corporate Officer/Principal at Kingmax Technology, Inc.
Profile
Ping Hsien Wu is currently a Vice President at Kingmax Technology, Inc. Prior to this, he held positions as Director at Kingmax Digital, Inc. and Kingpak Technology, Inc. Wu received an undergraduate degree from Chinese Culture University.
Ping Hsien Wu active positions
| Companies | Position | Start |
|---|---|---|
| Kingmax Technology, Inc. | Corporate Officer/Principal | 2011-10-01 |
Former positions of Ping Hsien Wu
| Companies | Position | End |
|---|---|---|
Kingmax Digital, Inc.
 Kingmax Digital, Inc. SemiconductorsElectronic Technology Kingmax Digital, Inc. engages in the design, manufacture and sale of memory modules. Its products include secure digital cards, micro secure digital cards, compact flash cards, pen drive flash disks, universal serial bus and micro secure digital card readers, and solid state drive. The company was founded on December 4, 2001 and is headquartered in Taipei, Taiwan. | Director/Board Member | - |
| KINGPAK TECHNOLOGY INC. | Director/Board Member | - |
Training of Ping Hsien Wu
| Chinese Culture University | Undergraduate Degree |
Experiences
Positions held
Connections
1st degree connections
1st degree companies
Male
Female
Members of the board
Executives
Linked companies
| Private companies | 3 |
|---|---|
Kingmax Digital, Inc.
Kingmax Digital, Inc. SemiconductorsElectronic Technology Kingmax Digital, Inc. engages in the design, manufacture and sale of memory modules. Its products include secure digital cards, micro secure digital cards, compact flash cards, pen drive flash disks, universal serial bus and micro secure digital card readers, and solid state drive. The company was founded on December 4, 2001 and is headquartered in Taipei, Taiwan. | Electronic Technology |
Kingpak Technology, Inc.
 Kingpak Technology, Inc. SemiconductorsElectronic Technology Kingpak Technology, Inc. engages in the testing and sale of complementary metal-oxide semiconductor (CMOS) image sensor, CMOS image sensors (CIS) and integrated circuit packaging. It mainly focuses on consumer products, wearable products, safety monitoring & automobile related CIS packaging as well as video testing services. The company's products include CMOS image sensor, micro-electro-mechanical systems (MEMS), ball grid array (BGA), and system in package (SiP). Kingpak Technology was founded on May 8, 1991 and is headquartered in Taipei, Taiwan. | Electronic Technology |
| Kingmax Technology, Inc. |
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