Cheng Bin Zhang
Chief Tech/Sci/R&D Officer at Henghui Technology Corp. Ltd.
Cheng Bin Zhang active positions
| Companies | Position | Start | End |
|---|---|---|---|
Henghui Technology Corp. Ltd.
 Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Chief Tech/Sci/R&D Officer | 2017-12-31 | - |
Career history of Cheng Bin Zhang
Training of Cheng Bin Zhang
| Qilu University of Technology | Undergraduate Degree |
Statistics
International
| China | 3 |
Operational
| Chief Tech/Sci/R&D Officer | 1 |
| Undergraduate Degree | 1 |
Sectoral
| Producer Manufacturing | 2 |
| Consumer Services | 2 |
Positions held
Active
Inactive
Listed companies
Private companies
Linked companies
| Private companies | 1 |
|---|---|
Henghui Technology Corp. Ltd.
Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Producer Manufacturing |
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