Bao Zeng Wang
Director/Board Member at Henghui Technology Corp. Ltd.
Bao Zeng Wang active positions
| Companies | Position | Start | End |
|---|---|---|---|
Henghui Technology Corp. Ltd.
 Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Director/Board Member | 2020-10-31 | - |
Career history of Bao Zeng Wang
Training of Bao Zeng Wang
| Southeast University | Graduate Degree |
Statistics
International
| China | 3 |
Operational
| Director/Board Member | 1 |
| Graduate Degree | 1 |
Sectoral
| Producer Manufacturing | 2 |
| Consumer Services | 2 |
Positions held
Active
Inactive
Listed companies
Private companies
Linked companies
| Private companies | 1 |
|---|---|
Henghui Technology Corp. Ltd.
Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Producer Manufacturing |
- Stock Market
- Insiders
- Bao Zeng Wang
- Experience
