Amkor Technology, Inc. Stock

Equities

AMKR

US0316521006

Semiconductor Equipment & Testing

Market Closed - Nasdaq 04:00:00 2024-05-13 pm EDT 5-day change 1st Jan Change
32.69 USD +0.18% Intraday chart for Amkor Technology, Inc. +0.99% -1.74%
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Sales 2024 * 6.54B Sales 2025 * 7.26B Capitalization 8.05B
Net income 2024 * 403M Net income 2025 * 605M EV / Sales 2024 * 1.18 x
Net cash position 2024 * 311M Net cash position 2025 * 602M EV / Sales 2025 * 1.03 x
P/E ratio 2024 *
19.8 x
P/E ratio 2025 *
13.3 x
Employees 28,700
Yield 2024 *
1.05%
Yield 2025 *
1.17%
Free-Float 38.11%
More Fundamentals * Assessed data
Dynamic Chart
1 day+0.18%
1 week+0.99%
Current month+1.05%
1 month+0.99%
3 months+9.29%
6 months+37.64%
Current year-1.74%
More quotes
1 week
32.13
Extreme 32.13
33.25
1 month
28.15
Extreme 28.145
35.95
Current year
28.15
Extreme 28.145
37.00
1 year
17.58
Extreme 17.5814
37.00
3 years
14.89
Extreme 14.89
37.00
5 years
5.40
Extreme 5.4
37.00
10 years
4.01
Extreme 4.01
37.00
More quotes
Managers TitleAgeSince
Chief Executive Officer 66 14-01-14
Director of Finance/CFO 50 04-12-31
Chairman 88 97-08-31
Members of the board TitleAgeSince
Director/Board Member 83 98-06-30
Director/Board Member 65 14-07-31
Director/Board Member 61 15-01-31
More insiders
Date Price Change Volume
24-05-13 32.69 +0.18% 633,892
24-05-10 32.63 0.00% 420,252
24-05-09 32.63 +0.28% 551,647
24-05-08 32.54 -0.73% 689,221
24-05-07 32.78 +1.27% 961,319

Delayed Quote Nasdaq, May 13, 2024 at 04:00 pm EDT

More quotes
Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and test technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; and electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
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More about the company
Trading Rating
Investor Rating
ESG Refinitiv
C+
More Ratings
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
7
Last Close Price
32.69 USD
Average target price
39 USD
Spread / Average Target
+19.30%
Consensus
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