Investor

Presentation

May 2024

Safe Harbor

This presentation contains "forward-looking statements", within the meaning of the safe harbor provisions of the U.S. Private Securities Litigation Reform Act of 1995, as amended, that are based on management's expectations, estimates, projections and assumptions. Words such as "expects," "anticipates," "plans," "believes," "scheduled," "estimates" and variations of these words and similar

expressions are intended to identify forward-looking statements. Forward-looking statements include, but are not limited to, those

regarding anticipated growth and trends in our businesses and markets, industry outlooks and demand drivers, our investment and growth strategies, our development of new products and technologies, our business outlook for current and future periods, our ongoing transformation initiative and the effects thereof on our operations and financial results; and other statements that are not historical facts. These statements and their underlying assumptions are subject to risks and uncertainties and are not guarantees of future performance. Factors that could cause actual results to differ materially from those expressed or implied by such statements include, without limitation:

global trade issues, including the ongoing trade disputes between the U.S. and China, and changes in trade and export license policies; the

level of demand for our products; global economic and industry conditions; global conflicts; our dependency on third-party suppliers and outsourcing partners; the timing of customer orders; our ability to develop, deliver and support new products and technologies; our ability to expand our current markets, increase market share and develop new markets; the concentrated nature of our customer base; cybersecurity attacks and our ability to safeguard sensitive information and protect our intellectual property rights in key technologies; the effects of regional or global health epidemics; our ability to achieve the objectives of operational and strategic initiatives and attract, motivate and retain key employees; the variability of results among products and end-markets, and our ability to accurately forecast future

results, market conditions, and customer requirements; the impact of our indebtedness, including our convertible senior notes and our

capped call transactions; and other risks and uncertainties described in our SEC filings on Forms 10-K,10-Q and 8-K, and from time-to- time in our other SEC reports. All forward-looking statements speak only to management's expectations, estimates, projections and assumptions as of the date of this presentation. The Company does not undertake any obligation to update or publicly revise any forward- looking statements to reflect events, circumstances or changes in expectations after the date of this presentation.

2 Investor Presentation

Copyright © 2024 Veeco Instruments Inc. All Rights Reserved.

Contents

Overview

Veeco at a Glance

Who is Veeco?

Strategy & SAM Opportunities

Investment Strategy

SAM Opportunities

Financials

Historical Revenue

2024 Outlook

Customers, Resource Alignment, Veeco Team & ESG

Backup & Financial Tables

3 Investor Presentation

Copyright © 2024 Veeco Instruments Inc. All Rights Reserved.

Veeco at a Glance

Global provider of

semiconductor capital

equipment

Differentiated technologies with opportunities to expand served available markets

Patents

>350

Employees

~1,200

2023 Revenue

$666M

Solving customers high value

materials challenges

Financial strength and flexibility

4 Investor Presentation

Copyright © 2024 Veeco Instruments Inc. All Rights Reserved.

Who is Veeco?

Semiconductor

Strong History

Solving materials challenges

Data Storage

Compound Semiconductor

2019- Today

2010 - Today

Differentiated Laser

1990's - Today

MOCVD Technology Fabricated

Annealing & Ion Beam

Growth Focus

Ion Beam Technologies for

70%+ of LED's globally

Deposition technologies

Semiconductor & Compound Semiconductor

enabling most advanced

manufacturing of 100% of

chips on the planet

HDD heads

Well Positioned

Leading edge customers drive growth

5 Investor Presentation

Copyright © 2024 Veeco Instruments Inc. All Rights Reserved.

Strategy & SAM

6 Investor Presentation

Copyright © 2024 Veeco Instruments Inc. All Rights Reserved.

Investment Strategy Enabling SAM Expansion

Technologies

Driving Growth

TODAY

SAM Expansion

Driving FUTURE

Growth

Evaluation Program

Anchors Growth

Strategy

Future

  • LSA gaining share in advanced logic due to performance benefits
  • EUV Mask Blank Business well-positioned for High NA adoption
  • Strength in Wet processing driven by High-Bandwidth Memory
  • Laser Annealing SAM to grow above 1.0B from $600M
    • LSA penetrating new memory customers
    • Nanosecond Annealing for 3D devices, backside power, & material modification in logic & memory
  • IBD for Front End Semi growing from $0 to $350M
    • Low resistance metals applications in memory & logic
  • Compound Semi opportunities in Power Electronics and Photonics
  • NSA & IBD programs progressing well
  • Targeting LSA shipment to 2nd leading Memory customer in late 2024
  • Compound Semi program advancing

7 Q1 2024 Financial Results Conference Call

Copyright © 2024 Veeco Instruments Inc. All Rights Reserved.

LSA - Laser Spike Annealing

IBD - Ion Beam Deposition

NSA - Nanosecond Annealing

SAM - Served Available Market

EUV - Extreme Ultraviolet

Available Market

Veeco's Served Available Market to grow to ~4.3B

Semiconductor opportunity expected to grow to ~$2.0B driven by Laser Annealing, Nanosecond Annealing and Ion Beam Deposition equipment

Compound Semiconductor opportunity expected to grow to ~$1.8B driven by equipment for Power Electronics (SiC & GaN) and Photonics

8 Investor Presentation

Copyright © 2024 Veeco Instruments Inc. All Rights Reserved.

Total Veeco SAM

~$4.3B

Projected CAGR ~15%

~$2.4B

2024

2028

Semiconductor

Compound Semiconductor

Data Storage

Scientific & Other

SAM - Served Available Market SiC - Silicon Carbide GaN - Gallium Nitride

* Veeco Served Available Market based on TrendFocus, Gartner, Yole Group and internal analysis

Semiconductor SAM Growth

Key Drivers of SAM Growth (Systems Only)

2024

2028

Laser Spike

PTOR at three Tier 1 logic and one Tier 1 memory

Annealing

~$600M

~$750M

customers' advanced nodes

Total SAM

~$2.0B

Projected ~20% CAGR

(LSA)

Nanosecond

Under evaluation at two Tier 1 logic customers

New Annealing

Ideal for new advanced node 3D device applications,

~$0M

~$450M

~$1.0B

IBD300

IBD EUV

NSA

Ion Beam

Deposition

(NSA)

including backside power delivery

IBD

EUV Mask

• PTOR for EUV mask blank deposition

~$50M

~$100M

Blanks

Ion Beam

Deposition

LaserLSA

Annealing

20242028

Laser

Annealing

IBD300

New Front End

Semi

  • Under evaluation at two Tier 1 memory customers

IBD differentiates vs. traditional PVD for deposition of

~$0M

~$350M

high-density films requiring low resistivity

Key applications are memory bit-line & logic wiring

Laser Annealing

Nanosecond Annealing

IBD EUV

IBD300

Advanced Packaging

Services

Laser Annealing, Nanosecond Annealing and IBD300 to drive growth in Semiconductor market

Source: Veeco Served Available Market based on TrendFocus, Gartner, Yole Group and internal analysis

EUV - Extreme Ultraviolet

9

Investor Presentation

IBD - Ion Beam Deposition

PTOR - Production Tool of Record

Copyright © 2024 Veeco Instruments Inc. All Rights Reserved.

PVD - Physical Vapor Deposition

Amounts may not calculate precisely due to rounding.

Nanosecond Annealing Opportunity

Temperature (°C)

2000

1000

100

NSA

Future

(nanosecond)

LSA

Traditional

Lamp Based

(sub millisecond)

(sub second)

Time

• Device scaling challenges driving the need for new annealing

capabilities

• NSA broadening Laser Annealing adoption to new Logic and

Memory applications

Shallow anneal enabling backside power delivery and 3D

devices

Material Modification steps to improve performance by

changing device structure and properties

Illustration of Wafer Cross Section

• Potential for initial logic HVM orders in 2025 & strong pull from

Heating Depth

Very

shallow

Heats full

wafer

NSA

10nm-100nm

LSA

~100 μm

Traditional

Lamp based

Full wafer

memory customers

Nanosecond Annealing to enable a broad range of advanced logic and memory applications

HVM - High Volume Manufacturing

NSA - Nanosecond Annealing

10

Q1 2024 Financial Results Conference Call

LSA - Laser Spike Annealing

Copyright © 2024 Veeco Instruments Inc. All Rights Reserved.

Attachments

  • Original Link
  • Original Document
  • Permalink

Disclaimer

Veeco Instruments Inc. published this content on 05 June 2024 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 05 June 2024 13:21:08 UTC.