By Denny Jacob


Chipmaker Intel disclosed collaborative efforts between its chip manufacturing business and companies including Cadence Design Systems, Ansys and Synopsys.

Intel Foundry and Cadence announced several key milestones in their strategic partnership collaborating on efforts including 3D-IC enablement, EDA flows and IP development across multiple Intel process nodes. The work between the two sides is done with the artificial intelligence era in mind.

Ansys said it is joining the Intel Foundry Accelerator USMAG Alliance to support the design of secure and efficient chips for national security and government applications. Ansys' semiconductor simulation tools will be optimized to deliver secure design methodologies and workflows to meet the requirements of Intel Foundry's process design kits.

Synopsys disclosed the availability of its production-ready multi-die reference flow for Intel Foundry's embedded multi-die interconnect bridge advanced packaging technology.


Write to Denny Jacob at denny.jacob@wsj.com


(END) Dow Jones Newswires

06-24-24 1220ET