Aehr Test Systems announced it has received an initial order from a new customer for its FOX-XP test and burn-in system for singulated bare die testing and burn-in of integrated silicon photonics devices for data communications applications. The over $2 million order includes a FOX-XP system and a set of custom DiePak® carriers that enable burn-in and aging of integrated lasers and special circuitry on the silicon photonics devices. The order includes down payments per Aehr Test’s standard terms and conditions of sale and shipment is expected during the second calendar quarter of 2018. The FOX-XP system, available in multi-wafer and singulated die/module test configurations, is capable of functional test and burn-in/cycling of integrated optical devices, 2D and 3D sensors, magnetic sensors, flash memories, microcontrollers, and other ICs. The ICs can be burned in and tested on the FOX-XP system either in full wafer or singulated die form before they are assembled into single or multi-die stacked packages or after being assembled into module panels or singulated modules. A single FOX-XP test system may be configured with up to 18 Blades of test resources, enabling up to 18 blades to test and burn in full wafers simultaneously at up to 1 kW per Blade or up to 9 Blades configured to test wafers or singulated die and modules with up to 2 kW per Blade. Each Blade may be configured with up to eight Universal Channel Channel Modules (UCCMs), High Current Channel Modules (HCCMs), or High Voltage Channel Modules (HVCMs) to supply device stimulus to burn-in, cycle, and test the individual die or modules. The footprint of the 18-wafer test system is similar to the footprint of typical semiconductor Automatic Test Equipment (ATE) that can only test one wafer at a time. The FOX-XP system utilizes Aehr Test's custom FOX WaferPakTM contactors and DiePak carriers to provide cost-effective solutions for making electrical contact in a multi-Blade environment. FOX WaferPak contactors contain up to tens of thousands of probes to contact all die simultaneously on wafers and substrates up to 300mm. The optional WaferPak Aligner provides fully automatic alignment of the customer’s wafers to the WaferPak contactor. DiePak carriers are capable of routing up to 2048 unique resource channels from the Blade electronics to the singulated die or modules under test. The optional DiePak Loader enables volume production loading/unloading and sorting of the customer’s modules to the DiePak carrier.